Prime minister of India has inaugurated SEMICON India 2026 to be held from September 17-19, 2026 in New Delhi. Addressing the occasion and highlighting the significance of the event’s fifth edition, the prime minister extended warm greetings to all participants. He expressed gratitude to the international attendees who had travelled to India to participate in the summit.
President and chief executive officer (CEO), SEMI, said the global semiconductor market is forecast to reach $3 trillion by 2035 and urged India to build indispensable capabilities across key value-chain segments.
Meanwhile, CEO, Micron Technology, said commercial DRAM and NAND production is live at Sanand, Gujarat.
Further, CEO, Infineon Technologies, highlighted the company’s more than 2,800 employees in India, its skilling partnership with NIELIT and opportunities in power semiconductors, smart mobility and automotive electrification.
Furthermore, Dr Randhir Thakur, CEO and managing director (MD), Tata Electronics, confirmed that the construction of Dholera 300mm fab and Jagiroad OSAT facility is on track. He informed that Tata Electronics shall be signing seven MoUs in the areas including inter-alia semiconductor wafer manufacturing, assembly and test; building advanced semiconductor packaging capabilities; supply of photoresists and advanced chemicals for fab; localisation of critical semiconductor materials, and talent development, with Fujifilm, Nexperia, BESI Singapore Pte. Ltd, JSR Corporation etc.
CEO, Tokyo Electron, committed support for India’s upcoming wafer fabs and advanced packaging facilities and announced a semiconductor training centre in Gujarat next year in partnership with the Government of Japan.
CEO Electronics, Merck, emphasised that fab viability requires parallel local investment in ultra-pure semiconductor chemicals and gases, safe materials handling and certified domestic suppliers.
In addition, president, SPG, Applied Materials, announced ‘India Vision 2035’: a USD 5 billion investment over the next decade and tenfold expansion of its India-based supply-chain capacity by 2035.
Chief operating officer (COO), Lam Research, announced approximately Rs 100 billion for the company’s first silicon-component manufacturing and vertical ingot-processing plant in India, and said its Semiverse programme has reached over 99 universities.
In addition, executive vice president (EVP), ASML, reiterated its partnership with Tata Electronics for lithography solutions at the Dholera fab and said ASML is considering the possibility of integrating Indian suppliers for its global supply chain.
Meanwhile, Union minister for electronics and IT, railways, and information and broadcasting noted that while foundational groundwork has been done under Semicon 1.0, including 70,000 design engineers trained and EDA tools deployed across 500+ organisations, Semicon 2.0 scales ecosystem development across six comprehensive pillars: Design, Equipment & Materials, Fabs, Advanced Packaging, Applied R&D and Talent.
Prime minister virtually inaugurated commercial production lines at CDIL Semiconductor, Mohali for discrete devices and Suchi Semicon, Surat for packaging. This has resulted in five operational commercial semiconductor ATMP units, alongside Micron, Kaynes, and CG Semi, out of the twelve approved units under Semicon 1.0.
Addressing the gathering, the prime minister highlighted India’s execution velocity and macro resilience with 7.8 per cent quarterly GDP growth, 3,000 km of operational dedicated freight corridors, a sovereign rating upgrade and a successful BRICS Summit hosted by India. Outlining the relentless momentum of the sector, the prime minister highlighted the expansion of the India Semiconductor Mission budget from $8 billion in Semicon 1.0 to $13.5 billion for Semicon 2.0.
Detailing the vision for a robust domestic supply chain, the prime minister urged leaders in equipment, chemicals, gases, and materials to capitalise on the golden opportunities presented by the twelve approved projects and an expanding demand pipeline. “We want the entire ecosystem to grow together,”asserted the Prime Minister.
At the conference, secretary, MeitY, declared that India has “truly arrived” in the semiconductor space, announcing the transition to Semicon 2.0 after committing its initial six-year funding phase in just four years.
Further, strategic MoUs and announcements spanning design, fabrication, packaging, materials, equipment and skills involved Tata Electronics, Kaynes Semicon, Intel, Nexperia, CDIL Semiconductors and their partners. Key outcomes included India’s first commercial QFN chip by Suchi Semicon and eInfochips, integration of the India-designed SenseSoC-200 chip into smart meters, six ChipIN Regional Centres and HORIBA India’s KOACH Experience Centre.
Addressing the media, union minister outlined ‘Semicon 2.0’, marking India’s transition from foundational credibility to comprehensive domestic capability.
The India-USA Country Roundtable brought together government and industry representatives from 64 Indian companies and 52 international organisations. Discussions focused on commercial partnerships, joint ventures, R&D, supply chains and skills across the semiconductor and electronics value chain.
The India-Japan Semiconductor Roundtable focused on combining Japan’s strengths in equipment, materials and precision manufacturing with India’s demand, design talent and expanding manufacturing base through joint ventures, technology transfers, localised supply chains and R&D.
The opening day featured focused sessions charting India’s transition from foundational policy planning to large-scale execution across the silicon value chain. These sessions covered AI-enabled chip design and manufacturing, advanced packaging, next-generation manufacturing, equipment R&D and workforce development.