The foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar, Odisha. The project marks a significant step towards strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing.
Addressing the gathering, chief minister of Odisha described the project as a historic milestone for state and the nation. He said that for the first time in India, an advanced 3D glass solutions semiconductor project is being established, bringing immense pride to the state. He noted that global technology leaders such as Intel, Lockheed Martin, and Applied Materials are associated with cutting-edge packaging technologies, and their interest in Odisha reflects the state’s growing industrial strength.
He also flagged that the products manufactured in the state will support next-generation sectors such as artificial intelligence (AI), high-performance computing, defence electronics, telecommunications, and advanced digital systems. “Odisha is ready to play a pivotal role in realising prime minister’s vision of making India self-reliant in semiconductor and electronics manufacturing,” he added.
Further, he informed that the company is investing nearly Rs 20 billion in the project and the facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and around 13,000 advanced 3DHI modules. He added that Odisha has emerged as the only state in the country where both India’s first compound semiconductor fabrication unit and first 3D glass substrate packaging facility are being established.
Furthermore, he said the growing semiconductor ecosystem in Odisha will open large-scale employment opportunities for engineering graduates, diploma holders, and ITI students, helping transform the state from a resource-based economy into a technology-led growth centre.
Meanwhile, addressing the gathering, union minister for railways, electronics and information technology, and information and broadcasting congratulated the people of Odisha on the landmark initiative and appreciated the support extended by the state government. He said, under the visionary leadership of prime minister, India’s semiconductor sector is witnessing rapid growth, with Odisha emerging as an important contributor to this transformation.
Further, as per the union minister, Odisha, traditionally known for its strengths in minerals, metals and energy, is now steadily establishing itself in advanced sectors such as electronics, IT and semiconductors. Describing the project as one of the most advanced manufacturing initiatives of its kind, he said it would significantly strengthen India’s semiconductor value chain.
Highlighting the country’s progress in electronics manufacturing, he said production in the sector has grown six-fold over the past 12 years. “India has now become the world’s second-largest mobile phone manufacturer and emerged as the leading exporter of mobile phones in 2025”, he added.
He further informed that two semiconductor projects have already been approved for Odisha under the India Semiconductor Mission, while three more electronics and semiconductor-related proposals are in the pipeline. “Discussions are also underway with major global companies, including Intel for future investments in the state,” he mentioned.
In addition, state minister for electronics and IT said Odisha is fast emerging as a semiconductor hub, with two approved projects under the India Semiconductor Mission, including the advanced 3D Glass unit inaugurated today. He said the state government’s IT, AI, global capability centre and Semiconductor Policies 2025 will drive innovation and attract investments. Emphasising skill development, he said stipend support for engineering students is being provided to build an industry-ready workforce. He added that initiatives like the Blackswan Summit 2026 and growing AI investments will create jobs and strengthen Odisha’s leadership in future technologies.
The project is being implemented by 3D Glass Solutions Inc. (3DGS), USA, through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions Private Limited at Info Valley in Khordha district. It is a greenfield, vertically integrated advanced packaging and embedded glass substrate advanced therapy medicinal products facility.
The total investment in the project is Rs 19.43 billion, including approved central fiscal support of Rs 7.99 billion and additional state support of approximately Rs 3.99 billion. The facility will cater to high-growth sectors such as data centres, AI, machine learning, 5G/6G communications, automotive radar, defence electronics, aerospace applications, and photonics. Commercial production is expected to begin by August 2028, while full-scale volume production is targeted by August 2030.